CPS The World Leader in AlSiC Products Now Offers Pin Fin Coolers for Hybrid Electric Vehicle IG

High reliability, CTE compatibility, and light weight, along with strength, and stiffness are key factors in the design of coolers for power modules in Hybrid Electric Vehicles (HEV) applications. CPS AlSiC coolers meet this challenge with optimum thermal performance and consistent reliability throughout the application life cycle. Liquid cooling is the most effective way to dissipate heat (1 - 2KW) in HEV power module applications. CPS AlSiC coolers cost effectively offer the pin fin geometries that are required for effective liquid cooling. In addition, CPS AlSiC coolers provide an isotropic thermal expansion that is compatible with device/electronic substrate to reduce mechanically induced stresses during power thermal cycling for improved electronics and module reliability. The AlSiC device compatible thermal expansion (8 ppm/°C) simplifies IGBT assembly compared to Cu pin fin coolers (17 ppm/°C) thermal expansion, eliminating the need for stress compensation layers that increase thermal resistance, assembly complexity and module cost.

AlSiC is a lightweight material (1/3 that of Cu), which makes it an ideal cooler material for the weight-sensitive hybrid electric (HEV), electric vehicle (EV) application and in kinetic energy recovery systems (KERS). AlSiC also has higher strength and stiffness than Cu, which, combined with its lightweight nature, makes AlSiC coolers more tolerant of shock and vibration.

The CPS AlSiC fabrication process efficiently produces both the composite material and fabricates the product geometry in one process step. CPS can work with customers to provide designs that are fabricated to shape requiring no finished machining for very cost effective cooler production.

About CPS Technologies Corporation

CPS Technologies Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. CPS uses a net-shape fabrication process, including patented QuickSet„¢ injection molding and QuickCast„¢ infiltration. AlSiC components are used in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS is a publicly traded company (symbol -œCPSH-). CPS' customers include TI, Motorola, HP, Infineon, Agilent and Amkor. For more information on CPS' AlSiC components, contact Mark Occhionero marco@alsic.com at 1 (508) 222-0614 x 242 or Samuel Hopp shop@alsic.com at 1 (508) 222-0614 x 242 at or visit www.alsic.com.

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