Y-Series Why We Are Unable To Visualize Our Creator - God (Allah) A Theoretical Explanation

The ancient ages reflect that the concept of the Creator and His worship had been a good vital part of the people. Antique pictures and engraved sketches of the past and findings in the history depict the myth of the "One" Mysterious-to-work-for, unseen to devote the lives, and matter to differentiate the people of knowledge!Now days when people have developed a stronger sense of understanding the things and problems. They have devised many visualizing techniques in order to explain somehow their physical picture of the problem in real 3 Dimension. It is very comprehensible to tackle a problem by its model-picture; the perception becomes clear and the person recognizes what we want to tell and says, "O I see, what you mean to say..."!The scientific explanation to the people asking about the picture of our "God" is very simple to elucidate. The people who are curious about the mysterious and hidden nature regarding to their Creator must know a very simple Cartesian space. In Physics and this physical world there exists only 3-dimensional coordinate system basically. These are x, y, and z-axes. Analogy is here to explain why we are unable to seek or simply we can perceive our creator. Walking on a line, one direction, or x-axis gives us just one-direction of freedom to walk or concentrate on. One can only walking on this line like oscillatory movement. Example given is like when we make an ant to creep in a small, narrow pipe line, she can only walk into it, from one side to the other or opposite.Now, we jump into a 2-dimension plane. What happens here is simply this ant has an option to direct herself on this plane in right or left sides... meaning x or y directions. We acquire a bit higher degree of freedom 3-dimension. In such a coordinate system, we have a freedom of not only walking in two dimensions but also we can/are able to fly in z-direction. Flying a bird or airplane can be an example.Now, let's consider a body in 2 dimension space. It can have a possibility of either moving in one direction x or using an opportunity to walking in both directions freely: x and y but it has no chance/degree of freedom to fly because its space dimensions are only 2-D. therefore speaking about a body in 3-D has complete 3 directions to use but not the 4th. Because, in human world there is no physical 4th dimension to imagine or consideration about its existence, we can just imagine or realize only the lower degree of freedoms as 3 to 2 or being in 2 to only 1. Similarly the upper degrees of freedom are NOT possible to understand or visualize in this clear physical world. Here is the same analogy to visualize our creator.Physically speaking, God - Allah - is in the 4th dimension. But we human being are unable to jump from this coordinate system higher to 4th one. The same as a caged bird is make to only walk in 2-d and can not imagine the experience of flying in 3-d which is feasible in this physical world.Actually, it is possible to cross such a "barrier" making our degrees of freedom constrained. This is only possible if we die and when this barrier of death is crossed and we enter into a complete other dimension where God exists physically. But to cross such a barrier is irreversible phenomenon and the people can not "explain back" their experiences to visual God. It should not be reversible because God is a mystery which would become clear to every human being on the Day of Judgment (Arabic - Alyaum-ul-Quamah) when the whole humanity will certainly be summed up and be accountable for their deeds in 3-D world. Until that time to visualize God - like to watch anything else in our universe - is physically IMPOSSIBLE. It is only and only possible when we cross the barrier - the barrier of our death.

The Many Processes of Silicon Wafer Processing

Most people have heard the term silicon wafer, but unless you are a science or Information Technology professional, you will be forgiven for not knowing what a silicon wafer is. This type of device is most common in the fields of IT, physics and chemistry and known to professionals such as physicists and chemists. The silicon wafer processing is an interesting one. Technically, this device is a thin, circular disc used in the manufacture of integrated circuits and semiconductors. There are other types such as Gallium Arsenide (GaAs) and SOI, which is silicon on insulator. These types are used in electronics, which require careful manufacturing to ensure high levels of efficiency. Although the device is tiny, the silicon wafer manufacturing process is tedious and complicated. It is comprised of several sequential processes that are repeated in order to complete photonic or electrical circuits. Examples of their use include the production of central processing units for computers, optical components of computers, LEDs, and radio frequency amplifiers. During fabrication, the appropriate electrical structures are placed within the wafers.

Extensive work precedes the production and several important steps are to be followed preceding the manufacture. In itself, silicon is a unique element, due to its capacity to conduct both electricity and heat in a way that is very controlled. It is otherwise known as a semiconductor. These wafers can become efficient materials in the electronic sphere when they undergo processes such as photolithography and fabrication. In microelectronics, these wafers are used in creating microchips or integrated circuits. The manufacturer of chips takes great care of many processes such as selecting the most reliable supplier to ensure efficient devices. Top consumer electronics and information technology companies have used SOI wafers to produce their microprocessors. Solar energy technology also uses GaAs, silicon and SOI wafers to create solar cells. Electrical engineers start the process by designing the circuits and defining the essential functions. Signals, voltages, outputs and inputs are specified. Special software is used to determine these specifications. It is then exported to programs that lay out the designs of the circuits. These programs are similar to those for computer-aided design. During this process, the layers of the wavers are defined.

Firstly, a perfect crystal should be produced from silicon. It must be submerged slowly into a vessel with molten sand. Afterwards, the ingot (cylinder shaped pure silicon) is carefully withdrawn. The ingot is then thinly sliced, using a diamond saw and the sliced sorted, according the thickness of each wafer. The manufacturers see to defects that occur during the slicing process. If the silicon surface is damaged or cracked after slicing, this is removed using a process known as lapping. If crystal damage is removed, they use etching to do so. The wafers are checked for flatness and thickness. During this step, they are checked for defects that occurred during the etching and lapping. An automated machine checks the thickness of each disk. A layer of damage is created in the back by grinding it to approximately thirty-five microns. The wafer is then heated to a temperature of up to more than one thousand degrees Celsius for up to three hours. It is then cooled to below six hundred degrees Celsius. Uneven surfaces of the wafers need to be polished to create a flat and smooth surface. A final qualification check is done during which the manufacturer ensures the smoothness and thickness. During this check, specifications of the consumer will also be ensured before the products will be ready to produce. The price of wafers is determined based on the thickness and quality. The wafers are blank when started and then built up in clean rooms. Photosensitive resistance patters are photo masked onto the surface. They are measured in micrometers or fractions right at the beginning of the process; therefore, the density is increased during each step. It is then exposed to UVB (short-wave) light. The areas that are unexposed are cleaned and etched away. Heated chemical vapors are then deposited onto the required areas and they are baked. The high heat permeates the vapors into the necessary areas. RF-driven sources of ions deposit 0+ or 02+ onto the zones in particular patterns. The process is repeated several hundreds of times. During each step, the resolution of the circuits is greatly increased. The technology is constantly changing and with new technology comes denser packing of the features. The semiconductor waves or chips are manufactured at foundry for companies, which sell the chips. The system of silicon wafer processing is an interesting one and when we think about all the ways in which it affects our lives, it is truly amazing. About the Author: Jessica entered the Semiconductor Manufacturing field in 1998 at Standard Microsystems Corporation of Hauppauge New York where she acquired valuable knowledge in both semiconductor processing and production management. Jessica has held positions at Integrated Micromachines and Xponent Photonics prior to founding Rogue Valley Microdevices in 2003. As Founder and CEO, Jessica has established the company as a world-class supplier of silicon wafer Services and MEMS Foundry Services.

Helping the Blind

For the last decade, groups of cell biologists, chemists and physicists all over the world have been focusing their motivation of research for the improvement of human life. Biological backgrounds interpreted with the chemical understandings of a living cell have led physicists to fabricate "Intelligent Devices" sensing alternative to those organs which are naturally integrated in the human body.Broadly speaking these built-in or integrated organs (eye, nose, skin, ear, tong, heart, lungs, etc) in the human body are the devices which provide a man "a signal" of an image, touch, taste, hearing, smell. These impulsive signals are then transmitted through the tissue to the respective part of the central processing unit, the brain. The theme of the today's research is to imply this simple natural process, design and fabricate a substitute to these sensors when the built-in sensor does not work for certain reasons. These substituted devices are called Implants. An example of such an implant is the Retinal Implant.The Retinal Implant An eye is a precious part of a human which plays an integral sensory role for the visual capability of the vision. Because of many factors this part may come to loose its visionary sensing power in some human beings. For example, Age-Related Macular Degeneration (ARMD) is a progressive disease of the retina wherein the light-sensing cells in the central area of vision (the macula) stop working and eventually die Ref [1]. By replacing the dead part of retina with the retinal implants, theoretically and practically, the diseases related with retina can hopefully be controlled.The principle and working of an EyeThe construction of the Eye is similar to that of a camera. In principle, the visible light is focused by a lens on a screen called the retina and the image is realized. Fig.1 (please find at http://webvision.med.utah.edu/sretina.html) shows a cross-section of human eye ball with its different parts. The Retina, being the most significant in the functioning of the eye, is composed of layers with different cells as shown in Fig. 2 (please find at [http://www.farlops.com/images/photos/retina.jpg] )

The light first enters the Nerve Fiber Layer and the Ganglion Cell Layer, under which most of the nourishing and aiding blood vessels of the retina are located. This is where the nerve begins, picking up the impulses of the acquired image from the retina and transmitting them to the brain. The light is received by the Photoreceptor cells called Rods and the Cones. These cells convert light into nerve impulses, which are then processed by the retina and sent though nerve fibers to the brain. The nerve fibers exit the eyeball at the Blind spot and reach the brain through the Optic nerve. The further anatomical details can be found elsewhere. Ref. [2]The Retinal Implant FunctionalityTo help visually impaired patients, a visual prosthesis could be designed to be placed in the eye, either under or on the retinal surface, sub retinal areas, etc, in the optic nerve, or in the visual cortex of the brain. Each approach has certain advantages and disadvantages. [Ref. 3]

Based on the above principal idea, the light is sensed by a large assembly of photo-receptor diodes integrated on a Chip connected with the electrodes for the electrical power. This chip collects the information of the sketched image fall on it and triggers the family of cells grown on this chip. The function of this chip/implant is the same as the retinal photoreceptor cells which are connected with the bipolar cells and ganglions and transmitting the photo signal to the respective part of the optic nerve [Ref. 4]. It is not easy to explicate the phenomena for the transmission of the sensed sketch produced in the chip of photoreceptor diodes to the grown cells of the retina, and from them to the optic nerve. Biologists and chemistry people are trying to resolve these phenomenons into a simple, explainable and electronically feasible for the best possible performance of the retinal implants.Conclusion and Future workThere are certain flaws for the In-vivo application of retinal implants. Bio-compatibility, one of the first main issue, of an Implants means especially the metal electrodes and the whole chip (the electronics) must be able to resist the body environment. The electrolytic properties of the blood, pH and ionic behavior of the In-vivo environment are some crucial parameters, nowadays faced by the scientists. The compatible implants should also be longtime susceptible to the animals as well as to the human beings.

Similarly, the diffusion of liquids through the sealing and packed retinal implant is also a great challenge that limits the working period (life) of an implant. For the commercial available synthetic materials, (plastic foils, etc) the permeability rate of water vapors is 5*10-3 g/m2/day. Scientists are seeking the best possible material with the least permeation which would in turn enhance the life time stability and bio compatibility of the implant in the body.

Besides the state-of-the-art device fabrication improvements, a visual prosthesis must receive two types of inputs, information about the visual signal from the retinal implant and the power to run this whole electronic assembly. It is detrimental for the purposes of long-term implantation to have wires penetrating the body or imbedded batteries that could corrode and have to be replaced if not properly sealed as mentioned above. Alternatively, one can send the visual signal and power to the implant without the use of wires. Wireless communication can be accomplished with laser light or radiofrequency transmission.

Before performing experiments on the human eye, it is necessary to perform laboratory experiments to determine safe methods of device implantation and electrical stimulation of the retina. These studies are performed in vitro (i.e. outside the animal; using tissue preparations) and in vivo (i.e. in the living body). In order to carry out such experiments, approval must be obtained and granted from committees that monitor experimentation with animals and humans from all the over the world.Ref:

1: Age Related Macular Degeneration, Jennifer I Lim, ISBN 082470682X2: An Introduction to the Biology of Vision, James T Mcllwain, ISBN 05214989023: Neuroprosthetics: Theory and Practice, Kenneth W. Horch, ISBN 98123802214: Electrical multisite stimulation of the isolated chicken retina, et. A. Stett, NMI Reutlingen, Vision Research 40 (2000) 1785-1795

Wafer Bonding Selecting The Right Process For Making Powerful, Vertical LEDs

LEDs with a vertical geometry are promising candidates for deployment in solid-state lighting products because they can handle the high drive currents needed to deliver a high luminous output. Manufacturing this form of LED requires a wafer-to-wafer bonding process,which involves many variables that need to be optimised for the specific device design, say Thomas Uhrmann, Eric Pabo,Viorel Dragoi and Thorsten Matthias from EV Group. White LEDs are already impacting the general lighting market, and their penetration in this sector is widely expected to rise. The rate of adoption will be governed by three factors: luminous efficiency, cost per lumen installed, and lumens per socket. One way to improve all three areas simultaneously is to increase LED efficiency. But even greater gains to the lumen output of the luminaire and its cost-perlumen are possible by combining gains in efficiency with a higher drive current for the device. Cranking this up, however, increases LED heating. And to cope with this, the system designer must carefully manage heat that flows from the device junction to the package, fixture and surrounding environment. It is possible to increase the rate that heat flows out of the LED by using metal wafer bonding for transfer of the epistructure to another substrate. Take this step and the LED benefits on two fronts: it can rapidly conduct heat away through a metal bond with a low thermal resistance, and it can dissipate heat through a substrate with low thermal resistance. This approach can not only enhance the electrical properties of the nitride-based white LED, but also its blue variant and its red, orange and yellow cousins that are made from the AlInGaP material family. At EV Group, which is based in St. Florian, Austria, we are supporting the manufacturing of LEDs produced with a metal bonding process. Our involvement includes the recent launch of the first tool dedicated to this fabrication step – the EVG 560HBL. This piece of equipment is designed to deliver very high yields thanks to optimisation of pressure and temperature distributions, and it sets a new benchmark for throughput of up to 176 bondsper- hour for 2-inch wafer equivalents. Manufacturing nitride LEDs with a metal bonding process presents some different challenges. Sapphire, the most widely used platform for making blue and white LEDs, has the desirable attribute of high transparency, but it is a poor heat conductor. Consequently, high-power LEDs employing a lateral design are poor at dissipating their heat and run hot, which degrades device performance. To combat this, some LED manufacturers have developed vertical LED designs, which involve substituting sapphire for another carrier with higher thermal conductivity Switching to this design also simplifies the manufacturing process by eliminating an etching step required to form the n-contact in a lateral LED. In addition, the vertical architecture produces a vertical current path, leading to a lower forward bias and eliminating current crowding issues that are frequently seen for other LED designs. And there are other benefits too: the addition of the metal bonding layer ensures that all of the light exits from the top of the LED; and manufacturing may be simplified, because the vertical LED design uses the same process flow for different die sizes. In addition to high thermal conductivity, the bondinterface in a vertical high-brightness LED musthave excellent electrical conductivity. Fortunately,high thermal conductivity and high electricalconductivity tend to go hand-in-hand, and arefound in germanium and metallic substrates. Both ofthese are popular, but silicon is emerging as acarrier material, featuring high heat dissipation andlow thermal expansion. Using silicon also enablesvertical LED producers to include a Zener diodedirectly into the carrier substrate, which serves forthe electrostatic protection of the sensitive GaN LEDs. The metal bonding approach is the only one that is applicable to high-brightness LEDs, due to the requirement for low thermal resistance. This is not the only benefit of this type of bond, however – it can also increase the luminous efficiency of the device. It was first used in AlInGaP-based LEDs that are grown on GaAs substrates. Spontaneous emission from these devices is assumed to be isotropic, with half of all the light generated propagating towards the substrate, where most of it is absorbed, leading to lowering of overall device efficiency. Inserting a distributed Bragg reflector beneath the light-generating region of the LED could prevent this light loss to the substrate, but in practice this only works effectively on one optimised direction of light emission, and it is better to turn to wafer bonding, where a reflective layer is included in the metal stack. As an integral member of a stable of international titles serving the microelectronics’ world Compound Semiconductor is able to draw on the synergies of its sister titles EuroAsia Semiconductors and Solar, to increase its focus and expand its global horizons. With the largest global circulation and history of excellence, Compound Semiconductor remains the most effective and authoritative title for the industry and a must read platform for the compound semiconductor community worldwide. Whether you represent a new start-up, an established player in the business or a company moving into the III-V space, we have the marketing channels to provide an effective return on investment. For more information on Semiconductor

Y-Series- Precision and Accuracy - Physics and Religion

In daily life a physicist, of course in the life of every human being too, these two parameters play a worthy role. Well, Precision is the resemblance of the results or observations where as the accuracy is defined as the observation or grades of many experiments which results to a standard level found in the literature. A test can be precise but can not be accurate if it does not coincide to the standard results. An accurate experiment can be non-precise in another way. But in the scientific world precision and accuracy is always desired! If one makes a test experiment many times and gets the similar kind of results which does not deviate from the standard literature values then it is precise series of experiment and if those results are somehow coincide the standard values found in the literature then those experiments are called an accurate experiment with a good precision.Now coming back to the core of this article, it is always appreciated if we adopt the principle of precision and accuracy in our daily lives. More specifically when we speak about our religion. It is very simple to understand how! Due to a clear fact that we have been given clear pattern and design in our religion to simply follow that. Now the analogy to precision and accuracy can be applied in order to get the meaning of a religion clear. If we un-doubtfully adopt-n-follow these rules then we are accurate to our religion. If we follow some lines leaving some out or adding our interpretation based on our partial views then it is not accurate but these fellowship if regularly adopted is called precision on your action. God - Allah - wants to see Accuracy in our religion and not precision in our action.One is often surprised to hear that in Europe "if I follow some doctrines, then it is not me...or then what I am!" Usually people want to refine and define themselves on somehow "their own" ways, styles and desires which, openly saying, is not any faith or in any religion. It would be then an animalistic life with no moral values. A person with a religion is defined as someone who has attained a certain path to follow, who has a designed pattern of life style, which is a model of some principles which are not written by him but by the One Who created Him!Islam gives the Muslim a complete code of life! Life to lead and life to enjoy and it does not matter where you live...! The question is only if we can understand enough these principles to follow precisely and accurately. There becomes an intrinsic enjoyment if you get the definition of right-n-wrong cleared according to the Islamic platform. Sometimes it is heard that the rules are strict and there is no happiness in them or people trying to find "grey" in between white and dark. But one can reply to the questioners, if they interpret the definition based on the personal biased views, the modernity, or the moralistic values found in their "advanced culture" then for them definitely it is "hard to cope" Islam... but for the people of understanding who just follow what is written in the book of Allah, it is contrary!Least but not the last everyone wishes to have a rejoicing life but the matter is what defines a happiness! Anyway, if you grasp without a thought that we are being imposed-on by the rules of 1428 years ago when man was not that advanced like nowadays, then there is nothing to worry because on that point, Allah takes care for the person how has that strong faith.. Rather hearing or putting ears to others, it is better to focus oneself to one's inner satisfaction when you follow the Islamic rules precisely and accurately.

Y-series - An Easier Life - Implementation of The Scientific Know-how

Since to err is in our nature - human being - not the Robots or programmed masterpiece like Microsoft windows vista, it has been observed that one can pass life easily and error-free, somehow, by adopting Scientifics. The Scientifics can be defined as ones action or way of life in logical and planned manner according to the science...Mistakes can come in our lives at anytime. To overcome quickly is the key issue solved by yours up streaming to scientific knowledge, daily mathematics, or envelop calculations etc...One's living style can be optimized to a risk free, well-organized and strategically planned. In order to adopt and regulate ourselves accordingly we should update ourselves. The brain polishing is needed and, worthy to saying, knowledge of somehow scientific rules should be implanted in ones mind. A general working principle of the household appliances, electrical instruments and their power consumption should be in mind in order to roughly know the budget conditions of your life. One can program in small excel file...Modern cars with computer on board are very helpful in order to display you the mile age and engine-wise information. Mechanically, just basic understanding to the engine and power, would bring not only a lot secure driving and off course save your valuable and "hard-fruit" money but also one becomes atmosphere conscious i.e. CO2 exhaust to the surroundings which is a current global issue to tackle and save our future...The role of using modern instruments in home to control the "freshy" environment condition also needs some scientific know-how. A log registers temperature control and Relative Humidity which should be balanced in order to maintain a good healthy condition at home. Operating a digital or manually controlled appliance would in deed bring easiness in ones lives plus saving the energy...These some of the basics which every one should know in the household safety and home economics. Similarly keeping information about ones daily food matters and edibles would keep you fit and active for the daily work. A balanced diet controlled by value-added components measures how informative you are about your diet.As a basic key for a successful future, one should use or practice key board and fast type in order to save the time. The entire private or the official correspondence should be well organized in your home or office. In fact some mistakes or error are the result of our negligence to the data. When one has planned a life according to the budget it would become a lot easier to spend, to save for some rainy days. Know how about the balance sheet plays a good part in ones life.Information about current tax system and insurances is also a chapter is our book which must be updated accordingly. The general estimation of the tax should be in ones mind in order to pay off/get back from the Tax offices at the end of the year.Concluding in a remark that a role of scientific observation in ones life brings one very close to realizing God - the Creator - if visualized the Nature with opened eyes and understandings...

Microwave Packaging Technology - Tips for Assembling a Microwave Module

Microwave modules, hybrids, MICs (microwave integrated circuits), RF MMIC (monolithic microwave integrated circuits) modules, all require a unique set of materials and processes necessary to achieve reliable operations in extreme military, aerospace and commercial environments. Microwave packaging technology in the context of this article it refers to relatively small packages (smaller than the outline of your cell phone) hermetically sealed or "nearly" hermetically sealed chip and wire modules. Proper spacing of MICs interconnected with other passive components inside a ceramic or metal can to achieve a specific RF function is an art form that takes years to master. Here are a few things to keep in mind when assembling a microwave module.Design for manufacturability (DFM) is a critical concept in the early phase of microwave design. A poor design results in yield loss, production delays, reliability problems and unhappy customers. Microwave hybrid circuit designers must "design with the process in mind". Any circuit that can't be assembled within reasonable cost and schedule constraints is a bust. DFM requires designers to perform detailed computer stress and thermal modeling analysis up front before ever committing to production. Finite element analysis (FEA) identifies weakness in the mechanical design and guides the selection of materials based on the package geometry and coefficient of thermal expansion for each candidate material. Thermal modeling is another critical DFM requirement. Heat build up inside a microwave power module is the number one cause of early field failures. Based on the thermal analysis model designers can select the proper heat spreaders to keep the junction temperatures below specification and assure reliable operation.Microwave modules are manufactured with a unique set of materials and processes. Substrates made from copper clad Teflon are often used because of their desirable dielectric constant, low loss tangent and other RF properties. However, the teflon "soft board" material creates problems in die attach and wirebond. When the ultrasonic energy from a wirebonder hits the soft substrate the energy is dissipated and this effectively shrinks the bond window and leads to a lot of frustration during assembly. Gold tin (AuSn) eutectic die attach of gold back MMICs is a very common process in power modules. MMICs are made from very thin (.004 " and less) gallium arsenide material, which has about one half the fracture toughness of silicon. These fragile chips have to be carefully handled and soldered down to obtain a complete void free interface to the substrate, or risk hot spots and stress build up on the die surface. Deep access wire and ribbon bonding often follow after die attach. This is another critical process step far beyond the scope of this article.After assembly the next step is to hermetically seal the unit to protect moisture from entering the package. Laser welding aluminum alloys or seam sealing iron-nickel alloys is the preferred method to create a hermetic seal. What is hermeticity? The dictionary definition of the term "hermetic" means a seal that is gas tight or impervious to gas flow. In the context of a hermetically sealed microwave module it implies an airtight seal that will keep moisture and other harmful gases from penetrating the sealed package. Of course it also means that it keeps hydrogen and other gases from escaping, which can lead to a problem known as "hydrogen poisoning". MIL-STD-883 Test Method 1014 is the universally accepted test designed to determine the effectiveness or hermeticity of the seal. Lately, microwave companies are turning to plastics and other materials such as Liquid Crystal Polymers (LCP) to make the package. When the term "near -hermetic" or "non-hermetic" packaging is used it implies the package is made from polymeric materials as opposed to glasses, metals and ceramics. Non hermetic parts made from plastics reduce cost, weight, size and if designed, manufactured and tested properly hold the promise of a reliable substitute for a hermetic can. But a "non" or "near-hermetic" package simply put is not hermetic as defined by the military specs.In summary, there are many technical details that must be reviewed in order to successfully design, assemble and seal a microwave module. It begins with a careful design and focus on manufacturability. Assembly processes such as substrate fabrication, die attach and wirebond present their own set of problems unique to devices that operate at microwave frequencies and above. Finally, the decision to hermetically seal the device should be based on the susceptibility of the device types to moisture, the expected end use environment and lifetime of the product.

How new PCB design tools are tackling environmental compliance

A number of PCB design tools, e.g. Cadence Allegro and OrCAD, have been updated to address environmental concerns.

As well as adhering to RoHS/WEEE regulations by using components that are low in lead, mercury and a number of other toxic chemicals, there are other ways to -œgo green,- for example by developing systems that optimise energy efficiency without compromising performance. The new Orcad and Allegro PCB design products allow engineers to do this very effectively, hence their popularity.

One improvement has been the inclusion of IC (integrated circuit) power delivery analysis. This analyses power flow in the system using 3D sampling of power, signal and ground signals. It allows the user to optimise the impedance voltage of the PDN (power distribution network) while keeping voltage ripple to a minimum. This allows engineers to develop high-speed, low-power FPGA designs which meet environmental compliance, without affecting productivity.

New technology - 3D integrated circuits

PCB designers are looking at various new technologies to help create environmentally compliant products. 3D integrated circuits (often shortened to 3D IC) are one such area. A 3D IC is an electronic chip in which integration of active components is achieved in layers, both horizontally and vertically. Although the technology is still in its early stages, it is generating a lot of excitement.

There are several ways to manufacture a 3D IC. All start from the same substrate, a semiconductor wafer. This is a thin slice of silicon crystal (or equivalent product) into which microelectronic devices are implanted. It then undergoes various fabrication processes.

Monolithic 3D ICs involve the layering of electronic components and their connections onto a single wafer, which is then separated into individual dies (diced) to create a 3D circuit. The technology is limited because of the heat involved in its fabrication.

In wafer-on-wafer ICs, components are built onto two or more wafers, which are then thinned, aligned, bonded and diced. Vertical connections (called through-silicon vias or TSVs) pass through the layers. A variation on this is the die-on-wafer technique. Die-on-die ICs are also being investigated; these involve the integration of components onto individual dies.

Environmental benefits of 3D-ICs

Because of their impact on the environmental compliance of the resulting FPGA designs, 3D integrated circuits are generating a lot of excitement. They have a much smaller footprint than conventional ICs, allowing a lot of functionality in a tiny space. This minimises use of materials while allowing development of very powerful devices. Also, because connections are much shorter, there is minimal impedance and faster speed. Significantly, power consumption is dramatically reduced - by up to 100 times with a -œsignal on- chip. This not only reduces power consumption and operating costs, it also reduces wear-and-tear. Less heat is generated, meaning longer battery life and fewer components ending up in landfill sites.

When it comes to FPGA design, environmental compliance can take many forms, from using lead-free microprocessors to rethinking of the entire product design. It behoves all engineers to behave in an environmentally compliant manner - not least because it leads to increased revenue from likewise minded customers. If you need help creating environmentally compliant PCB designs, we at Enventure Technologies can help.

The Article is written by www.enventureonline.com providing Environmental Compliance and Fpga Design Services.Visit http://www.enventureonline.comfor more information on www.enventureonline.com Products & Services___________________________Copyright information This article is free for reproduction but must be reproduced in its entirety, including live links & this copyright statement must be included. Visit www.enventureonline.com for more services!

Related Articles - Environmental Compliance, Fpga Design, Mechanical Design, Mechanical Engineering, Pcb Design,

Email this Article to a Friend!

Receive Articles like this one direct to your email box!Subscribe for free today!

Business - Bright Chances In Pakistan - A Review (Part II)

Obchodní Chances1: Základní vědecký výzkum a rozvoj programů: A klíčem k úspěšnému podnikání a vitální část všech významných společností je jejich výzkumu a vývoje sektoru v rozvinutých zemích. Univerzity a velkých ústavů např Max Planck Institute, Fraunhoffer Institute, DLR (Deutsche Luft und Raumfahrt), Walter-Schottkyho-institut (WSI) v Německu, národní fyzikální laboratoř (NPL) UK, Národní ústav pro zdraví - USA, obnovitelné energie laboratoř - USA, CERN - Švýcarsko, CEA - Francie, NRI - Japonsko, atd... Mají užitečné nápady, tvarované do projektů, které končí v originální produkt jako důsledek silného vědeckého výzkumu. Pokud stejnou strategii a plánování je nějak přijata a provedena v Pákistánu - vybudovat oddělení výzkumu a vývoje v některých velkých a ekonomicky silné - člověk začít dobrým dceřinou společnost v rámci této společnosti. Jak? Dobře logicky to může být vzhledem k zaměření kvalitní výzkum na nové myšlenky vztahující se k průmyslu s vizí pro rozvoj nové nebo nějaké vylepšení a zdokonalení v již existujících produktů. Vytváření nových projektů v rámci r & d laboratoře by vskutku vedlo vláda a ministerstvo vědy a techniky, zaměřit se na práci šance. Odliv mozků nakonec, lze snížit tím, že je pevně pokročilé labs již k dispozici v okrese. Lze říci své dva tak zlepšení businessA: projekt se zaměřil na produktu na základě vědeckých researchB: dostupnost kvalitní vyrobené zboží v zemi znamená "žádný import" - uložení zdrojů společnosti nebo nepřímo rozpočet země...V důsledku toho také spolupracovat s jinými univerzitami a institut se použít některé z jejich pokročilé vybavení a nástroje pro vyhodnocení svých výrobků. Hlavním tématem je důraz na zahájení výzkumu a vývoje sektoru a nové průmyslové projekty, kde mozek může být využité a vědecké myšlenky mohou být technologicky tvar do užitečnou a trh náročné product.2: zemědělství a zemědělsko productPredominantly, Pákistán je zemědělství zemí. Většina výnosy je prostřednictvím zemědělské produkty. Hlavní plodiny pěstované jsou pšenice, rýže, cukrové třtiny, zeleniny a ovoce. Rýže basmati kvality je jedním z hlavních vývozy do všech velkých zemí světa. Produkované v "bavlny pásu" - slavný oblast pro produkci bavlny - kvalitní bavlny je zadní kost většiny našich průmyslových odvětví. Tato bavlna přispívá zásadní roli v textilním průmyslu. Textilní průmysl v Faisalabad - proslulého města pro textilní a textilie - v důsledku získaly mezinárodní uznání pro takové obchodní příležitosti v tkaniny. Pokud jsou s prioritou mezinárodních zákazníků vztahy a výměny nových myšlenek, člověk dokáže přeskočit z malé společnosti střední velikosti. Aspoň ale ne poslední, existuje mnoho otevřených dveří v tkaniny a textilní udržet dobrou úroveň v souladu s globální standardy.

Import zemědělských strojů je také plodné podnikání v současné době v poptávce. Vyspělých strojů nejen snížit čas, ale také lidské úsilí je reduced.3: minerální resourcesSalt doly, drahých skvosty, mramor - bílé a různé přirozeně vroubená vzory - se nacházejí tam hojnost. Jediným cílem je usilovat o moderních technologií do tunelu je ven a vylepšit do drahých kamenů pro export. Průmyslové řízení ve spolupráci s "Pokročilé mozku" může zdvojnásobit hodnotu produktu na globálních trzích. Použití počítačové marketing pro minerální látky a produkty by mohla sjednocovat hodně z řad jeho složkou.

Když hovoříme o globalizaci, dostaneme nápad stěsnáni identit a produkty k dispozici každému. Člověk dokáže pochopit, že snadnější přístup k dostupnosti produktu je klíčovým prvkem pro dobrý obchod. Pokud globalizace položky ke spotřebě v mezinárodních standardech jeden mohou získat právo "hodnota" čas consumed.4: telekomunikační, mobilní technologie osobně analýzy pár let, tento sektor je pokrok mílovými. Nově vznikajících technologií a nová zařízení pro lepší komunikaci přinesl společnosti cizinec investovat do tohoto sektoru. V současné době přístup k síti internet, mobilní komunikace, DSL a VoIP a "Domov oIP" projekty jsou/by měl být hlavní cíle pro investora z uvnitř země a také do zahraničí nadnárodní obavy. Významnou spolupráci mobilink GSM, Paktel, WARID, UFone jsou ve skutečnosti veřejné a vláda pod svým patronátem společnosti volný n-pouť a na kompatibilní termíny jednání. Stojí za to se říká, že zájem investorů z kterékoli části světa prostě mít krátký pohled na takové zlatý "příjmy generátor" v Pakistan5: Online bankovnictví: Pokud správně a modernizovat až do mezinárodních standardů, jeden může vyvíjet rychle prostředky. Existuje velká třeba internetového bankovnictví, aby se lidé mohou přenášet nebo získat přístup k jejich "tekuté peníze". On-line bankovní projekty by měly být dobrým krokem v Incentivization ve veřejném sektoru. Zákazníci a průmyslníci se know-how o rostoucí obchodní legendy založený na rychlé internetové bankovnictví. Online internetové bankovnictví byl rychlý a bezpečný způsob stanovení trans úvěry do nebo cizí země. Zavedení takového systému by je aktualizovat ekonomiku země. V současnosti internetové online bankovnictví potřebuje věnovat větší pozornost zaměřit na a také další zlepšení. Nadnárodní společnosti internet by měly spolupracovat při budování silné síť peněz do a ze země.Contd:

The person is blue to point sword at LED chip output and profit a little The champion of two tit

The person is blue and little and really very difficult in the past two years, make the transition and hit the high pressure of the fund, promotion and technical mature period of product quality are longer than the ones that anticipated. But from last the third quater, the business performance of the company realized the reversal at last, among them the blue integrated circuit Co., Ltd. of the person in Hangzhou has finished being as long as 10 situations lost continuously in quarter. This is that a company insists on developing the staple, insisting on researching and developing, adjusting the products and operating the structural achievement independently for a long time. Because financial indexes such as the stock, debtors,etc. are good, the asset-liability ratio is obviously reduced, the good developing state has appeared in integrated circuit design, Si semiconductor chip fabrication, this three major staples of shiny semiconductor device chip fabrication in the company, it is believed that company's achievement can still keep the powerful growth since the end of last year in 2010. " Blue microelectronic XiangDong Chen, Chairman of Co., Ltd., person of Hangzhou, send out, sigh with deep feeling while being above-mentioned at the intersection of company and shareholders' general meetings that hold a few days ago.

This year, the person is blue and little to increase the input into LED chip fabrication at first, will cut the low reaches and capsulate the business. For this reason, company start, finance, work again already, raise fund invest person of constituent company Hangzhou blue bright the intersection of core and high light the intersection of LED and chip of Science Technologies Co., Ltd. produce collinear to expand, produce event mainly, make this company become person's blue a little important income and profit source. Chen XiangDong especially emphasizes, person blue bright core is one of the domestic LED chip manufacturing companies on the largest scale, succeeded in entering the large-scale outdoor color screen project of the Tian'anmen Square of Beijing last year, in in 4 big outdoor color screens that use at the grand ceremony on National Day, there are chips to adopt person blue bright core of 2 yuan. The intersection of chip and products, LED of company, it positions to be high side and high quality, products gross margin percentage even high than the Taiwan counterpart at present, on the other hand, customer's cluster approves the products of high quality high price of company more and more too. And the American card happy photoelectric Co., Ltd. of Hangzhou set up last year positions high-quality LED to capsulate, did not produce the business volume last year, already very nearly the same that its LED capsulated performance index and foreign advanced stage, devoting more efforts to investing this year makes it produce benefit. XiangDong Chen show long-term technology research and development and accumulate, make company to be confident to get the intersection of LED and the intersection of chip and the intersection of manufacturing field and output and profit first domestic in future.

In addition, seeing that the productivity bottleneck met at present, the company should strengthen and produce the collinear technological transformation and expands and produce input this year, and start the research and development project that high definition decodes the chip. It is estimated the person is blue and little to realize and open the gross income about 1,200 million yuans in the whole year, and will reduce the credit scale appropriately, control the financial cost. More information can be found article-top at

Related Articles - The person is blue and little, LED, IC designs,

Email this Article to a Friend!

Receive Articles like this one direct to your email box!Subscribe for free today!

Sierra Circuits Quality Printed Circuit Board Material That Fits Your Needs

Different PCB materials result in a variety of PBC specifications and prices in printed circuit board prototyping and production. There are 1 or 2 layer boards that just require on pre-preg "core" or multiple layer boards which use two or more types of cores in construction. Pre-preg, a material made of fine layers of fiberglass "pre-impregnated" with a bonding agent or metal core in a sheet form, has many different measures depending on the intended use and the desired thickness. The thickness of your board can vary from a couple mils thick for flex boards to a quarter inch thick for heavy burn in boards. Core materials resemble slim double-sided boards with dielectric materials such as fiberglass along with a copper foil placed on each side; these usually come in predefined thicknesses.

PCB Prototype using FR4

FR4, the most widely used family of substrates in printed circuit boards, is a glass fiber epoxy laminate. FR4 is the most standard material with higher numbers (such as FR4-06, FR4-08) have higher temperature coefficients and lower dielectric constants. FR4 has a starting Tg of 140 degrees Celsius, FR4-06 has a Tg of 170 degrees and as you move up the family, the temperature increases.

PCB Prototype using Metal Core

Popular in Light Emitting Diode printed circuits boards, Metal Core has great heat elimination. A single layer MCPBC contains a metal base, usually an aluminum and non-conduction layer, a copper circuit layer, IC components and a solder mask. The metal core acts as an amazing heat sinks, to ensure the safety of the LED's.

PCB Prototype Using Polyimide for Flexibility

Tougher than FR4, polyimide sustains hotter temperatures; this makes it ideal for use in electrical insulation applications that meet the class H requirements. The polyimide consists of a silicone adhesive design as well as a polyimide film built to withstand high temperatures. It protects edge connectors, gold edge fingers during wave soldering, and the reflow soldering processes during PCB assembly. Another interesting fact about polyimide is the color. While most boards come out green in color, polyimide is easily distinguishable by its brown color.

PCB Prototype Using Teflon for High Frequency

PTFE/Woven glass base PCB materials require special drilling because when compared to FR4 the Teflon is soft. These materials do not carry the myth of being exotic any longer. PTFE/woven glass base materials give both rapid growth of applications operations and meet high-frequency demands on a material that has availability and proven performance.

PCB Prototype Using Arlon for Longer Life at Higher Temperatures

Use Arlon materials for the PCB fabrication of high performance and frequency dependent printed circuit manufacturing. Common applications include those vulnerable to high temperatures during processing such as applications containing significant lifetime temperatures and lead-free soldering. Examples include under-hood automotive controls, down hole drilling, burn in boards, aircraft engine instrumentation and industrial sensors.

Using Isola Range for PCB prototype

Advanced circuitry applications use Isola range, a high performance FR-4 epoxy laminate and pre-preg system. Isola's low dielectric constant and low dissipation factor create the ideal material for broadband circuit designs that require a faster signal speed and/or better signal integrity. Isola is also the leading manufacturer of Lead Free materials, their IS410 and 370HR are the main materials used for ROHS compliant boards.

Amit Bahl

Director of Marketing and Sales for Sierra Circuits, Inc. Amit is tasked with exploring and developing new markets for High Density Interconnect PCBs and Microelectronic substrates. Sierra Circuits, Inc. has primarily serviced the quick turn prototype market and is now actively developing the Medical, Military and Automotive markets. Prior to joining Sierra Circuits, Inc., Amit Bahl was a part of IBM's Global Services team, where he worked on automating and optimizing business processes using the latest Information technologies. Amit Bahl received his B.S.C in computer science with a minor in marketing from UCLA.

https://www.protoexpress.com/index.jsp

http://pcb-prototyping.ready-online.com/pcb-material.html

Related Articles - Sierra Circuits, Quality, Printed Circuit Board, PCB,

Email this Article to a Friend!

Receive Articles like this one direct to your email box!Subscribe for free today!

Experience In Germany

To mirror the community culture and a sketch of her life style in the shape of a pen to paper requires a clear, neutral observation and first hand experiences. A warm welcome in 2001 proved to be the first impression of security and protective measures in Germany. People of many nationalities

they spent here and are an integral part thereof. After paragraphs are my personal views of foreigners coming to Germany for some purposes, such as to promote higher education.Students from Asia-noticeably from Pakistan-may have a good chance to take advantage of the opportunity to recall and sharpen their minds with the technologies of art. Science and business administration are the main areas of attraction for us. About 157 | Pakistani students are

looking for more knowledge in the field of information technology, water resources, physics, chemistry, medical science, cultural and language learning in different universities, Germany There was inconvenience, which many of the villagers, especially the Muslims we monitor from Islamic countries. The main theme is the German language skills. It is clear that should be proficient in the language of the country where it is intended to fly. Alternatively, of course, and is very grateful for the universities to initiate intensive German step course for foreigners. Another important measure is the integration of started from 2005. The advantage of this course is essentially that of the participant which becomes experienced in everyday Conversation, etc. and find suitable jobs after a successful education. For the survival of the successfully, it is vitally important that one should also keep abreast of the German rules and bureaucratic processes, social principles and rules of operation.

Life in Germany is very much the pace of full and timely; off course, a necessary condition for a country called "Advanced and developed".In addition, the person who wants to be integrated in the German culture, as a useful contributor, the German economy still needs a bit of compromise. It is often seen that people, in particular, comes from an Islamic environment have a small dam and a new culture. This may be due to the

A personal hesitation or brought up. In respectful moralistically fellows have learned. The need for foreigners to open and expand ideas and vision to take the ideas of other Nations. People just know Islam as a religion of terror and restrictions; the media has

has nothing to do with images, spread throughout the world. People with a good degree of tolerance and a deep understanding of humanity can actually only the net stereotypic image of Islam from the TV screen. We'll show our positive integral contribution to the German forces, the intellectual intelligence. It is necessary that we show our perfect peaceful nature, friendly communication, a genuine honesty, a keen interest in know that other religion with a neutral as the brain also revealed from the same God-Allah-to show our deep tolerance towards others. For example, the tolerance of the Prophet David (PBUH), the tolerance of The Prophet Jesus (PBUH) and the tolerance of the last Prophet Mohammed (PBUH) showed at the beginning of the path to Tai ' f (a city in Saudi Arabia) for the distribution of the last religion the highest power of Allah. "With all of these traits and characteristics of a good human being, a person can begin and lead a happier life in any part of the world. Particularly in Germany, where the Basic Law: article 1-5: only for mankind, and personal freedom. States ' human dignity is inviolable, equality before

the law, freedom of belief and expression, etc. ... "In an environment of free-hand one can make a positive start with a good philanthropic life and also show the true nature of Islam. It would not be wrong to say that the German is a very friendly and warm good arrivals are in a sense a multicultural here. This means that the Earth's hatred was not found in this country of 82 million people ** that are about 2%, is the need for The Muslims, for the people of The East, to open their mind like a parachute because the parachute only works when it is opened in a different sense, it's just so they can be good integral hangers-on and add their significant contributions in the German economy, the improvement of the East-West

relationship as well. * Grund-und Strukturedaten 2005, the bmbf.

** General statistics from Germany

Introduction to sheet metal stamp

The company, which deal with the unique resources will need to be distinct factors which are not in the market place of the location of rapidly available. Metal stamping worksheet functions are employed to bend, sorting and reducing the content to develop these different components.A few of the processes used in stamping consist of body piercing, blanking, forming, embossing, and drawing. These procedures are carried out with instruments used volumes positive components, also recognized as hard tools. The operation for the development of the elements can be simple enough to require only one punch or die form. But some of the components are built by the generation of a sequence of stages that require many stations and hard technology, recognized as a progressive stamp.Stamping produces a wide variety of components for many industries, from palm-sized items for Microelectronics to the sides of the total car complete system. The top element of a can of soda, there is also a stamp method. The Organization should not be on their personal, though. Some functions with organizations that specialize in created to obtain alloys of a stamp. These corporations have components in their personal plants and ships them to you right after the production.

Negotiations with the company, which specializes in custom integrated sheet metal stamp and the production of less complicated, can focus on your group really has to offer. The Organization of the steelworks produced to order can supply also the options for reducing expenditures, exclusively in the ordering process a significant volume of a particular element, which may significantly more successful expenditure for the supplier of electronics and other items of the client. Ordering from one also ensures that your part was created by specialists who have dozens of meetings in a modified made manufacture of metal components and factors.For more information about "fuljenz", you really should go to: fuljenz

The Many Processes of Silicon Wafer Processing

Most people have heard the term silicon wafer, but unless you are a science or Information Technology professional, you will be forgiven for not knowing what a silicon wafer is. This type of device is most common in the fields of IT, physics and chemistry and known to professionals such as physicists and chemists. The silicon wafer processing is an interesting one.Technically, this device is a thin, circular disc used in the manufacture of integrated circuits and semiconductors. There are other types such as Gallium Arsenide (GaAs) and SOI, which is silicon on insulator. These types are used in electronics, which require careful manufacturing to ensure high levels of efficiency.Although the device is tiny, the manufacturing process is tedious and complicated. It is comprised of several sequential processes that are repeated in order to complete photonic or electrical circuits. Examples of their use include the production of central processing units for computers, optical components of computers, LEDs, and radio frequency amplifiers. During fabrication, the appropriate electrical structures are placed within the wafers.Extensive work precedes the production and several important steps are to be followed preceding the manufacture. In itself, silicon is a unique element, due to its capacity to conduct both electricity and heat in a way that is very controlled. It is otherwise known as a semiconductor. These wafers can become efficient materials in the electronic sphere when they undergo processes such as photolithography and fabrication.In microelectronics, these wafers are used in creating microchips or integrated circuits. The manufacturer of chips takes great care of many processes such as selecting the most reliable supplier to ensure efficient devices. Top consumer electronics and information technology companies have used SOI wafers to produce their microprocessors. Solar energy technology also uses GaAs, silicon and SOI wafers to create solar cells.Electrical engineers start the process by designing the circuits and defining the essential functions. Signals, voltages, outputs and inputs are specified. Special software is used to determine these specifications. It is then exported to programs that lay out the designs of the circuits. These programs are similar to those for computer-aided design. During this process, the layers of the wavers are defined.Firstly, a perfect crystal should be produced from silicon. It must be submerged slowly into a vessel with molten sand. Afterwards, the ingot (cylinder shaped pure silicon) is carefully withdrawn. The ingot is then thinly sliced, using a diamond saw and the sliced sorted, according the thickness of each wafer.The manufacturers see to defects that occur during the slicing process. If the silicon surface is damaged or cracked after slicing, this is removed using a process known as lapping. If crystal damage is removed, they use etching to do so.The wafers are checked for flatness and thickness. During this step, they are checked for defects that occurred during the etching and lapping. An automated machine checks the thickness of each disk.A layer of damage is created in the back by grinding it to approximately thirty-five microns. The wafer is then heated to a temperature of up to more than one thousand degrees Celsius for up to three hours. It is then cooled to below six hundred degrees Celsius.Uneven surfaces of the wafers need to be polished to create a flat and smooth surface. A final qualification check is done during which the manufacturer ensures the smoothness and thickness. During this check, specifications of the consumer will also be ensured before the products will be ready to produce. The price of wafers is determined based on the thickness and quality.The wafers are blank when started and then built up in clean rooms. Photosensitive resistance patters are photo masked onto the surface. They are measured in micrometers or fractions right at the beginning of the process; therefore, the density is increased during each step.It is then exposed to UVB (short-wave) light. The areas that are unexposed are cleaned and etched away. Heated chemical vapors are then deposited onto the required areas and they are baked. The high heat permeates the vapors into the necessary areas. RF-driven sources of ions deposit 0+ or 02+ onto the zones in particular patterns.The process is repeated several hundreds of times. During each step, the resolution of the circuits is greatly increased. The technology is constantly changing and with new technology comes denser packing of the features.The semiconductor waves or chips are manufactured at foundry for companies, which sell the chips. The system of silicon wafer processing is an interesting one and when we think about all the ways in which it affects our lives, it is truly amazing.

What's Cool About Micro-Electro-Mechanical Systems or MEMS For Short

You've probably seen, used and taken for granted items that run on micro-devices derived through MEMS Processes. Nano-technology may not have your attention, but the mighty power of micro-devices drives technology to new heights whether you're excited about it or not.There are many who have never heard the term Micro-Electro-Mechanical System commonly referred to as MEMS for those in the know. MEMS in a nutshell are tiny electro-mechanical devices that are closely related to silicon wafer processes for electronics. The main difference between silicon wafer processing and MEMS manufacturing is that MEMS has a mechanical nature that goes beyond the traditional etching and deposition used with thin films. Not too many people feign interest in the topics of micro-devices and micro-sensors, however, the technology and potential applications are pretty darn cool.MEMS technology takes place on super tiny structures with dimensions in the micrometer scale (one millionth of a meter). For the most part, almost all micro devices are built on silicon wafers utilizing integrated circuit technology. MEMS uses common wafer processes like thin film deposition to create integrated circuitry and then expands several processes beyond that technology to create micro-machines.MEMS technology uses three basic building blocks; the first of which is the thin film deposition on a substrate, second is applying a patterned mask using photolithograpic imaging, and lastly etching the films to the mask. The powerful micro-electronic capability combined with micro-mechanical components all in one miniature silicon substrate are allowing amazing advances in not only the field of microelectronics but other technologies such as photonics, nanotechnology and biomedical technology. This is paving the way for some very big advances in commercial market arenas, which I suspect will be getting broader audience of people excited about the topic of MEMS.Recent research in MEMS fabrication has lead to a number of advancements which include: micro-valves that control the flow of gas and liquid, micro-pumps, and micro-flaps that modulate airstreams. What's so cool about that? Well these devices are extremely small, but like ants these devices can perform mechanical feats far larger than their size would indicate effecting objects on a macro scale. A great example of this is a test done on full scale aircraft where micro-actuators have been able to steer the aircraft using only these tiny devices.Qualcomm has recently developed the industry's first MEMS display for mobile devices. As stated by the Qualcomm development team, "This is a true technological innovation that offers low power consumption and superb viewing quality in a wide range of environmental conditions, including bright sunlight. The display works by reflecting light so that specific wavelengths interfere with each other to create color. The phenomenon that makes a butterfly's wings shimmer is the same process used in Qualcomm's mirasol displays for e-readers."While the majority of people may not be aware or excited about the mighty power of micro-devices yet, perhaps the benefits and advancements of these technologies in respect to increased information capabilities, miniaturization of electronic systems, new products created at miniature dimensional scales, and increased functionality of macro devices will ignite a spark of interest in the years to come.

Jessica Gomez

Technology MEMS: A Tiny Package With Potential To Revolutionize Every Field of Technology

07th March 2012 Micro-electromechanical systems, more frequently known by the acronym MEMS, are micro devices which can be used as sensors, valves, gears, mirrors, actuators, and more. Most often combined with, or comprising, a microprocessor, they make possible the coll... Read >

Technology Introduction to Silicon Wafers used in Electronics

09th January 2012 Silicon wafers are actually semiconductor devices that are heavily used in today’s electronics. To some, these micro devices may seem dismissible but they really have important uses in technology. Silicon wafers are primarily used in manufacturing compute... Read >

Technology MEMS Fabrication and Micromachining Processes

22nd December 2011 Micro-Electro-Mechanical System - MEMS for short - is a fabrication process that explores potential applications for customized process technologies and processing capabilities of microdevices. In other words, MEMS technology is used to manufacture electr... Read >

Technology Silicon Wafers Quality And Cost Considerations

05th October 2011 Silicon is an element that is abundant in nature, is non-metallic and gray, and has a unique characteristic that has helped transform the world we live in. This characteristic is silicon's ability to conduct electricity. Being able to conduct an electrica... Read >

Technology Silicon Wafers Are Used In Electronics

10th May 2011 Silicon wafers are semiconductor devices used in many electronics today. Even though they sound like a snack, they have a very important job. They are used in making computer chips by many manufacturers. These tiny little wafers have a big job. You cannot... Read >

Technology Physical Vapor Deposition Of Thin Film

18th February 2011 PVD or physical vapor deposition is a method with the help of which a thin film of material is coated on a substrate by following certain steps. First, the material which is to be deposited is changed to vapor with the help of physical means. It is then t... Read >

Technology A Brief Overview of Manufacturing Processes for Semiconductor Devices

24th January 2011 Television, radio, cell phone and other electrical or electronics goods have semiconductor devices in them. The materials used in semiconductor devices are capable of partially conducting electricity, unlike full conductors of electricity like aluminum, c... Read >

Technology The New Age of Semiconductor Devices and Microelectronics Manufacturing

23rd November 2010 Modern engineering has stepped up many levels since the introduction of electronics. Large and bulky machinery has been reduced to mere hand held devices. This has become a wide spread and innovative change in most areas of manufacturing. What is microele... Read >

Technology Precision Manufacturing Of Silicon Wafers in a Nutshell

27th September 2010 Silicon wafers are probably the single most important component in the modern electronics industry. Millions of wafers are used in electronics devices and produced daily on a mass scale. The process of developing these essential little items took years to... Read >

Technology The Many Processes of Silicon Wafer Processing

18th August 2010 Most people have heard the term silicon wafer, but unless you are a science or Information Technology professional, you will be forgiven for not knowing what a silicon wafer is. This type of device is most common in the fields of IT, physics and chemistry... Read >

Study of various Refractive indices of Arsenide III-V Ternary Semiconductors

Study of various Refractive indices of Arsenide III-V Ternary Semi conductors V. Rama Murthy & Alla. Srivani Research Scholar Rayalaseema university P.G Department of Physics, T.J.P.S College Guntur-6 A.P India

Abstract: Many formulas have been proposed to estimate the refractive index (n) for III-V Ternary Arsenide semiconductors from the electro negativities of the constituent atoms. The proposed relation has been applied to Arsenide Ternary semi conductors belonging to groups III-V. It has proven advantageous over other estimates in the sense that there are fewer computational studies in the literature involving n and X for Ternary semi conductors. The computed values for the refractive index and Composition are found to be in good agreement with the known ones. A comparison between our present values and the ones in the literature is also done.

Keywords: Refractive index, Electro negativities, Composition, Optical properties, Compound semi conductors.

Introduction: 1)A pure elemental semi conductor such as silicon has uniform properties, with the same band gap and lattice properties. A simple binary semi conductor such as GaAs or InP also has uniform properties. we can get other properties by adding one or two other elements from the same groups of the periodic table to a compound semiconductor. 2)Semiconductors and semiconductor materials are used to fabricate microelectronic devices and opto electronic devices such as transistors, photo detectors and solar cells. 3)Semiconductors and semiconductor materials are useful because their electrical conductivity can be altered with dopants, an applied electric field, or electromagnetic radiation. There are two basic categories of semiconductors and semiconductor materials: electrical semiconductors and compound semiconductors. 4)Gallium arsenide (GaAs) and indium phosphide (InP) are examples of composite semiconductors that contain added materials or dopants. Semiconductor doping, the addition of a very small amount of a foreign substance to a pure semiconductor crystal, provides a semiconductor with an excess of conducting electrons or an excess of conducting holes. The first semiconductors and semiconductor materials produced electrical conduction through contact with a metal wire. 5)There are many applications for semiconductors and semiconductor materials in materials engineering, such as the fabrication of transistors, photo detectors and solar cells. Major semiconductor manufacturers and providers of semiconductors and semiconductor materials include Lattice Semiconductor Corporation, Xilinx, Altera, Actel and Quicklogic. Other semiconductor manufactures are located across the United States and around the world. 6)Materials science: Because of their application in devices like transistorsand lasers, the search for new III-V Ternary semi conductor materials and the improvement of existing materials is an important field of study. 7)Some of Arsenide group has indirect and some have direct band gap. 8)Arsenide group is second most common in use after silicon, commonly used as substrate for other III-V Ternary semi conductors 9)Quantum dots may be formed from a monolayer of InAs on InP or GaAs. 10)AlGaAs with composition close to AlAs is almost transparent to sunlight. It is used in GaAs/AlGaAs solar cells. 11)Arsenide III-V Ternary semiconductors are Well-developed material. Use in infrared technology and Thermo photo voltaics. Do pant content determines charge carrier density. For x=0.015, InGaAs perfectly lattice-matches germanium; can be used in multijunction photovoltaic cells. Used in infrared sensors, avalanche photodiodes, laser diodes, optical fiber communication detectors, and short-wavelength infrared cameras.

Objective: The main objective of this paper is to show Investigation of various Refractive indices of Arsenide III-V Ternary Semi conducting Compounds.

Purpose: The purpose of study is Investigation of various Refractive indices of Arsenide III-V Ternary Semi conductors to represent additivity principle even in very low composition range. In the present work we propose a simple relation for estimating the refractive index from the knowledge of Pauling's electro negativities, for semiconductors belonging to III-V Arsenide semi conductors.

Theoretical impact: 1) Ravindra et al. [9] proposed a linear relation governing the variation of the optical refractive index n with the energy gap Eg 2) Gopal [10] modified the Penn-model [11] for the high frequency dielectric constant of semi conductors to obtain a general formula relating n and Eg. ] 3) Reddy and Anjaneyulu [12] assumed another relation, which avoids the shortcomings of relations (1) and (2). This takes the form n = 3:59 - loge(Eg) 4) Based on the above considerations we assume a linear relation between the energy gap Eg and X in compound semiconductors, which is similar to that proposed by Duffy [17] for the case of alkali halide crystals. Accordingly, equation (6) can be rewritten in the following form n= F/(DX-D)1/4 5) The first approach of this paper is to determine the physical parameters like Refractive index for particular compositions and then to find the physical function describing the dependence of the physical parameters on the alloy Composition (x). 6) The second approach of this paper is to simultaneously fit in the data sets for all available compositions in order to minimize the discrepancies between the calculated and the experimental Data over the entire composition range.

Various Refractive indices of Binary Compounds: CompoundAlNAlPAlAsAlSbGaNGaPGaAsGaSbInNInPInAsInSb known (n)2.22.752.923.192.242.93.33.752.353.13.513.96 present (n)2.22.722.883.192.212.963.273.862.273.163.533.93 Ravindra (n)1.732.222.743.092.072.73.243.582.843.33.863.97 Gopal (n)2.242.492.863.182.42.823.363.842.943.424.364.62 Reddy (n)2.252.492.823.122.412.783.293.82.93.354.615.3

Various Refractive indices of Ternary Compounds: 1) AlxGa1-xAs = AlAs + GaAs CompoundAlxGa1-xAs = AlAs + GaAs x value00.10.150.20.250.30.350.40.450.5 known (n12)3.33.2623.2433.2243.2053.1863.1673.1483.1293.11 present (n12)3.273.2313.21153.1923.17253.1533.13353.1143.09453.075 Ravindra (n12)3.243.193.1653.143.1153.093.0653.043.0152.99 Gopal (n12)3.263.223.23.183.163.143.123.13.083.06 Reddy (n12)3.293.2433.21953.1963.17253.1493.12553.1023.07853.055

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.0913.0723.0533.0343.0152.9962.9772.9582.9392.92 present (n12)3.05553.0363.01652.9972.97752.9582.93852.9192.89952.88 Ravindra (n12)2.9652.942.9152.892.8652.842.8152.792.7652.74 Gopal (n12)3.043.0232.982.962.942.922.92.882.86 Reddy (n12)3.03153.0082.98452.9612.93752.9142.89052.8672.84352.82

2) InxGa1-xAs = InAs + GaAs CompoundInxGa1-xAs = InAs + GaAs x value00.10.150.20.250.30.350.40.450.5 known (n12)3.33.3213.33153.3423.35253.3633.37353.3843.39453.405 present (n12)3.273.2963.3093.3223.3353.3483.3613.3743.3873.4 Ravindra (n12)3.243.3023.3333.3643.3953.4263.4573.4883.5193.55 Gopal (n12)3.363.463.513.563.613.663.713.763.813.86 Reddy (n12)3.293.4223.4883.5543.623.6863.7523.8183.8843.95

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.41553.4263.43653.4473.45753.4683.47853.4893.49953.51 present (n12)3.4133.4263.4393.4523.4653.4783.4913.5043.5173.53 Ravindra (n12)3.5813.6123.6433.6743.7053.7363.7673.7983.8293.86 Gopal (n12)3.913.964.014.064.114.164.214.264.314.36 Reddy (n12)4.0164.0824.1484.2144.284.3464.4124.4784.5444.61

3) AlxIn1-xAs = AlAs + InAs CompoundAlxIn1-xAs = AlAs + InAs x value00.10.150.20.250.30.350.40.450.5 known (n12)3.513.4513.42153.3923.36253.3333.30353.2743.24453.215 present (n12)3.533.4653.43253.43.36753.3353.30253.273.23753.205 Ravindra (n12)3.863.7483.6923.6363.583.5243.4683.4123.3563.3 Gopal (n12)4.364.214.1354.063.9853.913.8353.763.6853.61 Reddy (n12)4.614.4314.34154.2524.16254.0733.98353.8943.80453.715

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.18553.1563.12653.0973.06753.0383.00852.9792.94952.92 present (n12)3.17253.143.10753.0753.04253.012.97752.9452.91252.88 Ravindra (n12)3.2443.1883.1323.0763.022.9642.9082.8522.7962.74 Gopal (n12)3.5353.463.3853.313.2353.163.0853.012.9352.86 Reddy (n12)3.62553.5363.44653.3573.26753.1783.08852.9992.90952.82

4) GaAsxN1-x = GaAs + GaN CompoundGaAsxN1-x = GaAs + GaN x value00.10.150.20.250.30.350.40.450.5 known (n12)2.242.3462.3992.4522.5052.5582.6112.6642.7172.77 present (n12)2.212.3162.3692.4222.4752.5282.5812.6342.6872.74 Ravindra (n12)2.072.1872.24552.3042.36252.4212.47952.5382.59652.655 Gopal (n12)2.42.4962.5442.5922.642.6882.7362.7842.8322.88 Reddy (n12)2.412.4982.5422.5862.632.6742.7182.7622.8062.85

x value0.60.60.650.70.750.80.850.90.951 known (n12)2.8232.8762.9292.9823.0353.0883.1413.1943.2473.3 present (n12)2.7932.8462.8992.9523.0053.0583.1113.1643.2173.27 Ravindra (n12)2.71352.7722.83052.8892.94753.0063.06453.1233.18153.24 Gopal (n12)2.9282.9763.0243.0723.123.1683.2163.2643.3123.36 Reddy (n12)2.8942.9382.9823.0263.073.1143.1583.2023.2463.29

5) GaAsxP1-x = GaAs + GaP CompoundGaAsxP1-x = GaAs + GaP x value00.10.150.20.250.30.350.40.450.5 known (n12)2.92.942.962.9833.023.043.063.083.1 present (n12)2.962.9913.00653.0223.03753.0533.06853.0843.09953.115 Ravindra (n12)2.72.7542.7812.8082.8352.8622.8892.9162.9432.97 Gopal (n12)2.822.8742.9012.9282.9552.9823.0093.0363.0633.09 Reddy (n12)2.782.8312.85652.8822.90752.9332.95852.9843.00953.035

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.123.143.163.183.23.223.243.263.283.3 present (n12)3.13053.1463.16153.1773.19253.2083.22353.2393.25453.27 Ravindra (n12)2.9973.0243.0513.0783.1053.1323.1593.1863.2133.24 Gopal (n12)3.1173.1443.1713.1983.2253.2523.2793.3063.3333.36 Reddy (n12)3.06053.0863.11153.1373.16253.1883.21353.2393.26453.29

6) InAsxSb1-x = InAs + InSb CompoundInAsxSb1-x = InAs + InSb x value00.10.150.20.250.30.350.40.450.5 known (n12)3.963.9153.89253.873.84753.8253.80253.783.75753.735 present (n12)3.933.893.873.853.833.813.793.773.753.73 Ravindra (n12)3.973.9593.95353.9483.94253.9373.93153.9263.92053.915 Gopal (n12)4.624.5944.5814.5684.5554.5424.5294.5164.5034.49 Reddy (n12)5.35.2315.19655.1625.12755.0935.05855.0244.98954.955

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.71253.693.66753.6453.62253.63.57753.5553.53253.51 present (n12)3.713.693.673.653.633.613.593.573.553.53 Ravindra (n12)3.90953.9043.89853.8933.88753.8823.87653.8713.86553.86 Gopal (n12)4.4774.4644.4514.4384.4254.4124.3994.3864.3734.36 Reddy (n12)4.92054.8864.85154.8174.78254.7484.71354.6794.64454.61

7) GaAsxSb1-x = GaAs + GaSb CompoundGaAsxSb1-x = GaAs + GaSb x value00.10.150.20.250.30.350.40.450.5 known (n12)3.753.7053.68253.663.63753.6153.59253.573.54753.525 present (n12)3.863.8013.77153.7423.71253.6833.65353.6243.59453.565 Ravindra (n12)3.583.5463.5293.5123.4953.4783.4613.4443.4273.41 Gopal (n12)3.893.8373.81053.7843.75753.7313.70453.6783.65153.625 Reddy (n12)3.83.7493.72353.6983.67253.6473.62153.5963.57053.545

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.50253.483.45753.4353.41253.393.36753.3453.32253.3 present (n12)3.53553.5063.47653.4473.41753.3883.35853.3293.29953.27 Ravindra (n12)3.3933.3763.3593.3423.3253.3083.2913.2743.2573.24 Gopal (n12)3.59853.5723.54553.5193.49253.4663.43953.4133.38653.36 Reddy (n12)3.51953.4943.46853.4433.41753.3923.36653.3413.31553.29

8) InAsxN1-x = InAs + InN CompoundInAsxN1-x = InAs + InN x value00.10.150.20.250.30.350.40.450.5 known (n12)2.352.4662.5242.5822.642.6982.7562.8142.8722.93 present (n12)2.272.3962.4592.5222.5852.6482.7112.7742.8372.9 Ravindra (n12)2.842.9422.9933.0443.0953.1463.1973.2483.2993.35 Gopal (n12)2.943.0823.1533.2243.2953.3663.4373.5083.5793.65 Reddy (n12)2.93.0713.15653.2423.32753.4133.49853.5843.66953.755

x value0.60.60.650.70.750.80.850.90.951 known (n12)2.9883.0463.1043.1623.223.2783.3363.3943.4523.51 present (n12)2.9633.0263.0893.1523.2153.2783.3413.4043.4673.53 Ravindra (n12)3.4013.4523.5033.5543.6053.6563.7073.7583.8093.86 Gopal (n12)3.7213.7923.8633.9344.0054.0764.1474.2184.2894.36 Reddy (n12)3.84053.9264.01154.0974.18254.2684.35354.4394.52454.61

9) InPxAs1-x = InP + InAs CompoundInPxAs1-x = InP + InAs x value00.10.150.20.250.30.350.40.450.5 known (n12)3.513.4693.44853.4283.40753.3873.36653.3463.32553.305 present (n12)3.533.4933.47453.4563.43753.4193.40053.3823.36353.345 Ravindra (n12)3.863.8043.7763.7483.723.6923.6643.6363.6083.58 Gopal (n12)4.364.2664.2194.1724.1254.0784.0313.9843.9373.89 Reddy (n12)4.614.4844.4214.3584.2954.2324.1694.1064.0433.98

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.28453.2643.24353.2233.20253.1823.16153.1413.12053.1 present (n12)3.32653.3083.28953.2713.25253.2343.21553.1973.17853.16 Ravindra (n12)3.5523.5243.4963.4683.443.4123.3843.3563.3283.3 Gopal (n12)3.8433.7963.7493.7023.6553.6083.5613.5143.4673.42 Reddy (n12)3.9173.8543.7913.7283.6653.6023.5393.4763.4133.35

10) AlAsxSb1-x = AlAs + AlSb CompoundAlAsxSb1-x = AlAs + AlSb x value00.10.150.20.250.30.350.40.450.5 known (n12)3.193.1633.14953.1363.12253.1093.09553.0823.06853.055 present (n12)3.193.1593.14353.1283.11253.0973.08153.0663.05053.035 Ravindra (n12)3.093.0553.03753.023.00252.9852.96752.952.93252.915 Gopal (n12)3.183.1483.1323.1163.13.0843.0683.0523.0363.02 Reddy (n12)3.123.093.0753.063.0453.033.01532.9852.97

x value0.60.60.650.70.750.80.850.90.951 known (n12)3.04153.0283.01453.0012.98752.9742.96052.9472.93352.92 present (n12)3.01953.0042.98852.9732.95752.9422.92652.9112.89552.88 Ravindra (n12)2.89752.882.86252.8452.82752.812.79252.7752.75752.74 Gopal (n12)3.0042.9882.9722.9562.942.9242.9082.8922.8762.86 Reddy (n12)2.9552.942.9252.912.8952.882.8652.852.8352.82

11) AlAsxP1-x = AlAs + AlP CompoundAlAsxP1-x = AlAs + AlP x value00.10.150.20.250.30.350.40.450.5 known (n12)2.752.7672.77552.7842.79252.8012.80952.8182.82652.835 present (n12)2.722.7362.7442.7522.762.7682.7762.7842.7922.8 Ravindra (n12)2.222.2722.2982.3242.352.3762.4022.4282.4542.48 Gopal (n12)2.492.5272.54552.5642.58252.6012.61952.6382.65652.675 Reddy (n12)2.492.5232.53952.5562.57252.5892.60552.6222.63852.655

x value0.60.60.650.70.750.80.850.90.951 known (n12)2.84352.8522.86052.8692.87752.8862.89452.9032.91152.92 present (n12)2.8082.8162.8242.8322.842.8482.8562.8642.8722.88 Ravindra (n12)2.5062.5322.5582.5842.612.6362.6622.6882.7142.74 Gopal (n12)2.69352.7122.73052.7492.76752.7862.80452.8232.84152.86 Reddy (n12)2.67152.6882.70452.7212.73752.7542.77052.7872.80352.82

Variation of various Refractive indices (n12) with composition (x) is given. It has been observed that Refractive indices (n12) increase for compounds (x=0.0-1.0) with the increase of composition.

Future Plans: 1) Current data set to include the most recently developed methods and basis sets are continuing. The data is also being mined to reveal problems with existing theories and used to indicate where additional research needs to be done in future. 2) The technological importance of the ternary semiconductor alloy systems investigated makes an understanding of the phenomena of alloy broadening necessary, as it may be important in affecting semiconductor device performance.

Conclusion:

This paper needs to be addressed theoretically so that a fundamental understanding of the physics involved in such phenomenon can be obtained in spite of Dependence of various Refractive indices in III-V Ternary Semiconductors On Composition. The semiconductors have been carried out because of computational complexities and difficulties associate with disorder in the alloys. Polycrystalline ternary composition materials find application in tunable detectors and in other optoelectronic devices. Our results regarding the Structural properties of the ternary alloys are found to be in reasonable agreement with the experimental data.

SUMMARY: I have reviewed the available information about various Refractive indices of structural parameters for 11 technologically important III-V Semi conductors Ternary Semi conductors.

Acknowledgments. - This review has benefited from V.R Murthy, K.C Sathyalatha contribution who carried out the calculation of physical properties for several ternary compounds with additivity principle. It is a pleasure to acknowledge several fruitful discussions with V.R Murthy.

References: Electronic address: salemazhar@yahoo.com [1] H. C. Casey and M. B. Panish, Heterostructure Lasers, (Academic press, New York, 1978). [2] D. K. Ghosh and L. K. Samantha, Infrared Phys. 26, 335 (1986). [3] J. L. Shay and J. H. Wernick, Ternary Chalcopyrit Semiconductors: Electronic Properties and Applications, (Pergamon Press, Oxford, 1975). [4] H. Morkoc, Nitride Semiconductors and Devices, (Springer, Berlin, 1999). [5] W. S. Chen and R. A. Mickelson, Proc. SPIE, 24th Annual Technical Symposium, 28 July, San Diego, California (1980). [6] S. C. Gupta, B. L. Sharma and V. V. Agashe, Infrared Phys. 19, 545 (1979). [7] A. Rogalski and W. Kaszuba, Infrared Phys. 21, 251 (1981). [8] R. R. Reddy, S. Anjaneyulu and R. Viswanath, Infrared Phys. 33, 385 (1992). [9] N. M. Ravindra, S. Auluck and V. K. Srivastava, Phys. Stat Sol. (b) 93, 155 (1979). [10] V. Gopal, Infrared Phys. 22, 255 (1982). [11] D. R. Penn, Phys. Rev. 128, 2093 (1962). [12] R. R. Reddy and S. Anjaneyulu, Phys. Stat. Sol. (b)174, 91 (1992). [13] R. R. Reddy, R. Viswanath and T.V.R. Rao, Proc. Indian Nat. Sci. Acad. 56 A, 421 (1990). [14] P. Manca, J. Phys. Chem. Solids, 20, 268 (1961). [15] J. A. Van Vechten, Phys. Rev. 182 (3), 891 (1969). [16] R. R. Reddy, S. Anjaneyulu and T.V.R. Rao, Infrared Phys. 33, 389 (1992). [17] J. A. Du_y, Bonding Energy Levels and Bonds in Inorganic Solids, (Longman (UK) 1990). [18] N. M. Ravindra, R. P. Bhardwaj, K. S. Kumar and V. K. Srivastava, Infrared Phys. 21, 369 (1981). [19] A. K. Jonscher, Dielectric Relaxation in Solids, (Chelsea Dielectric Press, London, 1983) 35. [20] L. Pauling, Die Natur der chemischen Bindung, (Verlag Chemie, Weinheim 1973). [21] Sargent-Welch Scienti_c, Catalog No. S-18806, Illinois (1979). [22] R. R. Reddy, M. R. Kumar and T. V. R. Rao, Infrared Phys. 34, 103 (1993). [23] T. S. Moss, Phys. Stat. Sol. (b) 131, 415 (1985). [24] R. R. Reddy, M. R. Kumar and T. V. R. Rao, Infrared Phys. 34, 99 (1993). [25] C. W. Robert, Hand Book of Chemistry and Physics, 57th Ed. (CRC Press,Cleveland, Ohio, 1977), B.85-178. [26] C. Kittel, Introduction to Solid State Physics, 5th Ed. (Wiley, New York 1977). [27] T. S. Moss, G. J. Burrel and B. Ellis, Semiconductor Opto-Electronics

Related Articles - Refractive index, Electro negativities, Composition, Optical properties, Compound semi conductors.,

Email this Article to a Friend!

Receive Articles like this one direct to your email box!Subscribe for free today!

Introduction to sheet metal stamping

The company, which is the special equipment they need different parts that are not readily available on the market. Sheet metal stamping processes are used to bend, form, and cut the material to create these special parts.The various procedures used in stamping belongs to the piercing, blanking, forming, embossing, and drawing. These processes are carried out with the tool, which is used for the production of volumes, a part of, also known as hard tools. Operations for the creation of parts can be simple, require only one punch or die form. But some parts are created using a series of stages that require more stations and complex system, known as progressive stamp.Stamping creates different parts for different industries, from palm-sized pieces for Microelectronics at the sides for automobile body. The upper part of a can of soda is also with the stamp of the processes. The company need not be the same, though. Some work with companies that specialize in the order of a metal stamping. These companies part of the orders in their own plants and ships you after manufacture.Negotiations with the company, which specializes in custom sheet metal stamping and manufacturing easier to focus on what your company actually provides. These companies represent a steelworks can also provide options for reducing costs, in particular when ordering a large volume of parts, which is more efficient, so that producers of electronics and other consumer goods. Ordering from one also ensures that your parts have been carried out by the specialists who have experience in the custom manufacture of metal parts and components.

Y-Series - A Review Of The Questions

Y-Series - A review of the questionsObservation of the surroundings and investigative thoughts about a great number of the mysterious questions starts to develop since childhood: it's a natural gift of qualities of a sound human brain. Born with an intellectual demarcation among various phenomena, a human being reacts to the environment with a suitable response. This response is, actually, due to a refined sum-up of the answers to his Y-questions which somehow he instituted naturally or piled up as he grew up and widened his brain. Sometimes he criticises by "skinning the hair off" and sometimes his analyses positively which leads him to a harmonious life system.Why - in short Y - series is a complex and summits our daily question. The minute queries which we observe in our work place, home, office, meeting with different people, social and cultural, mechanical or intellectual case... Y-series would present an extension of the ideas and brain shattering concepts. Some of the basic information is already available but the point is we have not touched although we know they exist. Handling such matters for example why science fails to explain certain phenomenon, why we pray to one God (Allah), What can make the things better, how we can bring happiness back, when is the time to hold up the rope and climb the mountain of obstacles, etc. Obstacles coming in the way of one's success matters only attention and solutions. When the limits of the case seemingly ends and a human being start to become "devastated or disappointed" Y-services would be a good alternate to jingle the keys unlocking the closed doors: those which brighten the person and lead him out of distressing situations.Outstanding as well as the common people from any part of our beautiful world face the same case sometimes but with different angles and view points. They endeavour to tackle it according to their resources and immediate environmental suitability available at that time. Some times they use their own experiences to get to the bottom of Y-question or occasionally they take the example of the personnel who had already experienced that situation and follow the results. Interpretation of those results could be altered because the person, who wrote at that time, can be in somehow different situations than current status of the daring a specific situation.Least but not the last, time to time addition in the Y-world excuses in advance for any kind of offence or misapprehension of any spiritual, logical or religious viewpoints. What time demands is to friendly reconsideration over the fact that there is much room above the top: other words to say that trying to understand in a tone what the author wants to convey is far better than a sudden criticism biased on one's personal views.

3 00 Taiwan innolux chi mei toppoly three times until the end of April next year-LED flood lights

Hefei BOE six family level in March 2010

This type of the year at the end of April,

TFT-LCD6 for fishing line valuables in Hefei great train station, an experimental zone starts. At present, the major part of the relatively easy surface roses, friut is expected that you should establish the limit in December. 6 task Line closed at the end of the year, looking pointedly at the firms are likely to be in the year 2010 to the tree tool. 6 Cable 10 thousand Yuan to buy the computer hardware. BOE 6 assortment want proportions along with 90 000 glass substrates by month, the development of the means of Plama element 15 million of the 18 million. Description of product or service, to handle the production series produced by 18.5 width allows them to 37 cm.

March production all 5.147 million units cooling trade, rising to 72%

Statistics TV series because of July to your House

Trade, development of 5.147 million units, an increase of 0.5%, 72%; that move probably was considered 155 million, an increase of 6.6% to 27%; internal divisions 3, 326, 000, Chop the string% 2, 97%; shares the 6.99 million appliances from 21%.

Move to our brand new, because the measured increase in 2009. September, 27% of exports of advanced cooling, air-con to foreign countries supports the

Solutions with one become less popular in more unlike 15 months after a slow recovery.

Chi Mei Optoelectronics on Taiwan Innolux Toppoly, three times finish towards the Apr interest rates. 2010

Taiwan Innolux 20 and

TPO simultaneous Web short-term take including administrators gain, triple merger. Three providers of insurance of the season to think about adoption of 6 shareholders meeting convened for approval of the merger, I'd say merge more wedding day was probably 30. April to create a point. Three companies of the actual combination, a particular organization can be really outlasting a list of constructive, yet Jiangzai redubbed the CMO, the problem

Producers CR front alignment.

the complete reorganization of the world top two early

Kelon Management expert, said a day within the next three to five, Hisense as sound from freezer capacity as a result of market share, and raises its own existing inside the second, first, and, to achieve the highest levels of the two options in the world. Zhou Xiao-Tian said, Hisense cooler market later point the actual higher final part which is then simply exceptional end tag associated with wine cooler fridge yr after between Hisense Kelon

The company in accordance with the very high come to an end the basics of creating laundry rocks.

Toshiba plans to increase and maintain the partnership as part of the Offshore

Press in which the gadget icon Japanese Toshiba offers to China on the basis of Internet shops jv to install during the action processor. Toshiba described will be able and thereby to the synergy of all the new Laptop, Nantong Fujitsu Microelectronics Corp., Ltd., almost certainly locked in the new% 80 of the establishment of the jv on it reveals. Currently, his claim to fame the actual functioning of the specific once time-consuming new Laptop

The Web store is about to create a functional counteroffensive, Dalian new notebook Tv guard and as a result the Director-General from Sichuan to seasonal Pro for a long time they did that particular 2010 profitability is in fact unknown advertisers sold in China, who experts say "may be the reason for the lowest 20% of the above firms Toshiba reveal."

The air, which may have as a result of home neater, warm air humidifier capture questions "on the fly"

The humidifier instead of item adds the term "clean" target. Most of the causes of a complete documented as as their around the humidifier that provides resources such as Radix, E allow Mr. system product may be ultra strong here in advoiding flu. People in which the electronic home cleaners of air around the household air sterilization filter is very limited, at the same time the abandon by the ocean, many people, that the goods and not as a secret on the basis of this propaganda, all the really insanely on each of our stop frozen zero flu cleaner and classified.

Housing the primary home "reveal the main value of the flat table Telly flat useful

Many cannot afford the rent, even the TV is more achievable, plywood. Two lifelong mantra sophisticated television, or it can be a plasma TV, your average price obtained suffered a strong decline. 06,07 2,3 million for a long time, usually 42 bench carved? 7 My engagement screens the custom paddle stirring message? 009 removed at the end of, expressed that 4,5 thousands of dollars, "fee", the real dramatic under the standard cost bungalow in the crisp resolution.

I'm an expert on the led lightfixture.com, while we provide the quality of the product, such as flood lighting, LED, LED light bar, LED SMD module, and more.

Related articles-led Flood light, LED light Bar,

Send this article to your friends!

Accept articles like this one directly to your e-mail Inbox!Subscribe for free!